Silicone Foam ESF‑7203G‑950RD
TONMAX ESF‑7203G‑950RD is ultra‑high‑stress silicone foam with low‑density and excellent compression‑set resistance. Red base color with customizable color options. Great shock‑absorbing, anti‑aging and weather‑resistant performance, ideal for shock absorption, buffering, sound‑insulation and electrical‑insulation in new‑energy and industrial equipment.
Thermally Conductive Silicone TCS‑6000‑300WR
TONMAX TCS‑6000‑300WR is high‑performance double‑sided self‑adhesive thermally conductive silicone. Delivers low thermal‑resistance under low assembly pressure with reliable electrical‑insulation. Thermal conductivity 3.0W/m·K, UL94 V‑0 rated, stable from ‑40℃ to 200℃ for electronics thermal management.
Thermally Conductive Silicone TCS‑6000‑40
TONMAX TCS‑6000‑40 is cost‑effective high‑resilience thermally conductive gap pad. 4.0W/m·K thermal conductivity, double‑sided self‑adhesive & soft texture. UL94 V‑0 flame retardant, stable ‑40℃~180℃. Fills air‑gaps between heat sources and heat sinks for efficient heat dissipation with reliable electrical insulation.
Thermally Conductive Silicone TCS‑6000‑90BU
TONMAX TCS‑6000‑90BU is high‑performance double‑sided self‑adhesive blue thermally conductive silicone pad. 9.0W/m·K thermal conductivity, low thermal‑resistance under low assembly pressure, great electrical insulation. UL94 V‑0, stable ‑50℃~180℃. Fills assembly gaps for heat transfer, insulation, damping and sealing for compact electronic devices.
Thermally Conductive Silicone TCS‑6000‑200A
TONMAX TCS‑6000‑200A is high‑performance thermally conductive silicone pad. Low thermal‑resistance under low compression force with excellent electrical insulation. 2.0W/m·K thermal conductivity, UL94 V‑0 flame retardant, stable ‑40℃~150℃. Multiple thickness & size options for electronics thermal dissipation.
Thermally Conductive Silicone TCS‑6000‑1000BU
TONMAX TCS‑6000‑1000BU is 10.0W/m·K self‑adhesive thermal gap pad. Low thermal‑resistance under low compression, excellent electrical insulation, UL94 V‑0 flame retardant, stable‑40℃~150℃. Minimum thickness 0.5 mm for high‑performance electronics thermal management.